Web29 jul. 2015 · 2015/07/29. 東京エレクトロン株式会社は、300mmウェーハプロセス対応の塗布現像装置CLEAN TRACK ACT TM 12の後継機であり、次世代パッケージング技術に … Web龙玺精密-半导体工艺设备+国外二手设备 龙先生18868521984(微) 注：设备状态不定期更新，是否已售出请咨询。
Lisa McAleer - Senior Process Engineer - Intel Corporation - LinkedIn
WebHad extensive experience with Photolithography Tools such as ASML Twinscan AT1200s, 870s..etc. Lithography inspection tools, TEL Lithius Track..etc Mostly I had to fulfil the following job scope: Plan and implement effective Preventive Maintenance (PM) program on the equipment, organize installation of new equipment to support the production ramp-up. WebTEL Lithius Pro Z Tokyo Electron Europe Toegekend: dec. 2024. Sokudo-Duo Level 1 & 2 ... Local Controller T&H Upgrade for TEL Clean Track ACT8 Top YIP Contributor Q2 2013(7 submission's) Infineon Technologies Kulim jul. 2013 Talen Malay ... oracle dbms_utility
Jeff McGuigan - Engineer - Intel Corporation LinkedIn
WebCLEAN TRACK™ LITHIUS Pro™ AP for 300mm wafer processing system incorporates fundamental concepts from the widely-installed CLEAN TRACK™ ACT™ 12, with … Surface preparation system CELLESTA™ series for 300mm single wafer clean … ANTARES™ is a series of a fully automated, single-wafer, CryoKinetic … Synapse™ series became an industry standard Bonding/DeBonding tools for … The UNITY™ achieves excellent cost performance for plasma etch process … The EXIM™ series expands TEL’s product portfolio with an innovative 300mm PVD … NT333™ is TEL’s first semi-batch chamber for ALD (Atomic Layer Deposition). It … The Triase+™ series offers extra value as the latest single wafer deposition … Cellcia™ series is the next generation wafer probing system for 300mm wafers. … Web1 apr. 2006 · Wafer processing was conducted on a TEL Lithius track (not interfaced). The photoresist used was TOK TArF P7047 with a film thickness of 260 nm, AZ Aquatar-6A Topcoat and a BARC of AZ 1c5d with a film thickness of 38 nm. All wafer metrology was done on a Hitachi 9300 SEM and process window analysis for experimental data was … Web1) Current Issues/Problems of Catch Cup Assembly at TEL Lithius Series A. Photo Resist tends to stick to Catch Cup during Continuous Operation. B. Photo Resist also stick to the Window of Drain and Exhaust at Catch Cup Assembly. C. These Contaminated Photo Resist Stains are the root-cause of Rebounded Particles and Defects over Process Wafers. portsmouth wightlink ferry terminal